Walsin Lihwa established its MEMS team in the year 2000 for MEMS R&D. In July 2001, the team was expanded and became the MEMS Business Unit with an MEMS OEM operation in Yangmei, Taiwan.

The MEMS Business Unit was spun off from Walsin Lihwa and became Touch Micro-system Technology Corporation in 2004. Based on the core technology of its 8-inch fab, Touch Micro-System Tech has been strengthening R&D while developing 4- and 6-inch wafers in order to develop itself into a leading MEMS manufacturer and technology platform provider.

R&D-wise, Touch Micro-System Tech cooperates with more than 30 major MEMS companies around the world in technology development, gaining production experience and independence of know how to develop various process platforms such as CMOS-MEMS/WLP, RF-IPD, Integrated Solution of Solid State Light Source, and Micro Mirror. Production wise, Touch Micro-System Tech¡¦s unique MEMS process development capability, commitment to OEM service quality, and integrated services from research to OEM have made the company an important product development partner to customers and a reliable MEMS fab for quantity production.

• Si DRIE :
  Si DRIE is an important technology for MEMS processing. The aspect ratio of Si DRIE at Touch Micro-System Tech can reach 20:1, and the etching profile can reach 90+/-2¢X, with outstanding uniformity of +/-4%. Si DRIE is applicable to the production of inkjet printer heads, biomedical chips, micro-inertial sensors, 3-dimensioanl MEMS, and TSV.
  
  
• Wafer Bonding :
  Wafer bonding is essential for wafer level packaging. The substrates for wafer bonding at Touch Micro-System Tech include glass, silicon, and SOI wafers, and there are many metal and non-metal bonging materials in conjunction with different bonding technologies to provide a full spectrum of choices and flexibility to customers. Moreover, Touch Micro-System Tech features an integrated pre-bonding and post-bonding process that combines cap wafer fabrication with bonded wafer thinning and dicing. Wafer bonding is the process to package and protect MEMS devices.
  
  
• Wafer Thinning :
  Wafer thinning is widely used in the semiconductor and MEMS industries to reduce die package thickness by decreasing wafer thickness. It is sometimes used in TSV to reduce deep silicon etching costs. Wafer thinning at Touch Micro-System Tech is able to reduce wafer thickness to lower than 100 um and total thickness variation (TTV) to lower than 5 um.
  
  
• High Aspect Ratio Electroplating :
  Electroplating is often used in MEMS to enable a high aspect ratio on wafer substrates. High aspect ratio electroplating at Touch Micro-System Tech is capable of copper, gold, and nickel electroplating on wafer substrates to reach an aspect ratio of 4:1 and film thickness above than 15 um with the support of a special thick photoresist process.
  

• CMOS-MEMS/WLP Platform :
  Touch Micro-System Tech¡¦s CMOS-MEMS/WLP Platform provides MEMS and semiconductor wafer packaging, utilizing MEMS wafers as the cap wafer to enable air tightness and protect integrated circuits and MEMS components. The CMOS-MEMS/WLP Platform is applicable to the production of micro-inertial sensors, micro-mirror components, MEMS microphones, and MEMS oscillators.
  
  
• Thin Film Integrated Passive Device Platform :
  Touch Micro-System Tech¡¦s Thin Film Integrated Passive Device Platform primarily utilizes the company¡¦s high aspect ratio electroplating technology to provide high-quality-factor inductors on glass wafers, featuring the company¡¦s MEMS thin film technology that is mature enough to enable high-density thin-film capacitors and resistors. These three passive components, which can be integrated into passive component circuits of specific functionality, are effective in reducing product area and thickness. To help designers rapidly familiarize themselves with the production of thin films, Touch Micro-System Tech provides complete design support documents including Design Rule, Cell Library, and Reference Design. Moreover, in order to assist customers in reducing their design cost and time, multi-project wafer (MPW) shuttle service corresponding to Touch Micro-System Tech¡¦s integrated passive device platform is also provided.
  
  
• Customization Process :
  Touch Micro-System Tech provides contract-based customization process development service to customers in response to the production process for a variety of MEMS products. The highly flexible, rapid customization development service is based on the development goals, timelines, and specifications agreed with customers to help transform their conceptual production processes into feasible, quantity production processes.